• High-Density Interconnect FPC PCB Board with UL Certification and 100% E-Test
  • High-Density Interconnect FPC PCB Board with UL Certification and 100% E-Test
  • High-Density Interconnect FPC PCB Board with UL Certification and 100% E-Test
  • High-Density Interconnect FPC PCB Board with UL Certification and 100% E-Test
  • High-Density Interconnect FPC PCB Board with UL Certification and 100% E-Test
  • High-Density Interconnect FPC PCB Board with UL Certification and 100% E-Test

High-Density Interconnect FPC PCB Board with UL Certification and 100% E-Test

Structure: Double-Sided FPC
Material: Polyimide
Combination Mode: Adhesive Flexible Plate
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Conductive Adhesive: Conductive Silver Paste
Flame Retardant Properties: V0
Samples:
US$ 10/Piece 1 Piece(Min.Order)
| Request Sample
Customization:
Manufacturer/Factory & Trading Company

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Diamond Member Since 2024

Suppliers with verified business licenses

Jiangsu, China
Experienced Team
The supplier has 5 foreign trading staff(s) and 2 staff(s) with over 6 years of overseas trading experience
Customization from Designs
The supplier provides design based customization services
OEM Services
The supplier provides OEM services for popular brands
Management Certification
The supplier has quality management system certification, including:
ISO9001:2015 certificate
IATF16949:2016 Certificae
to see all verified strength labels (19)
  • Overview
  • Detailed Photos
  • Main Products
  • Product Parameters
  • Company Profile
  • Process
  • Certifications
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
FPC
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Organic Resin
Brand
Customers Brand
Certification
IATF16949, UL, ISO
Surface Treatment
Gold Finger/Hard Gold
Test
100% E-Test
Layers
1-36 Layers
Copper Thickness
0.5-12oz(18-420um)
Hole Diameter
Min0.05mm
Min. Line Spacing
0.10mm(4mil)
One Stop Service
PCB Assembly, Component Sourcing, Box Building
Board Thickness
0.2-6mm
Solder Mask Color
Green/Black/White/Red/Blue/Yellow
Min. Line Width
0.10mm(4mil)
Max. Finished Board Side
1020mm*1000mm
Delivery
7 Days
Transport Package
Customized, ESD Bag/Vacuum Packaging+Bubble Bag,
Specification
10cm*10cm
Trademark
SNC
Origin
China
HS Code
8522909900
Production Capacity
500000PCS/Year

Product Description

Detailed Photos
 
High-Density Interconnect FPC PCB Board with UL Certification and 100% E-Test
High-Density Interconnect FPC PCB Board with UL Certification and 100% E-Test
High-Density Interconnect FPC PCB Board with UL Certification and 100% E-Test
 

Our Service

1. PCB Design, PCB Clone and Copy, ODM Service.

2. Schematic Design and Layout

3. Fast PCB & PCBA Prototype and Mass Production

4. Electronic Components Sourcing Services

5. PCB Assembly Services: SMT, DIP & THT, BGA Repair and Reballing

6. ICT, Constant Temperature Burn-in, and Function Test

7. Stencil, Cables, and Enclosure Building

8. Standard Packing and On-time Delivery

Main Products

High-Density Interconnect FPC PCB Board with UL Certification and 100% E-Test
The above are our highly recommended products for you. We have many other offerings not displayed here. For any specific requirements, feel free to click the link below for more information.
 
Product Parameters
 
Item Production Capacity
Layer Counts 1-20 layers
Material FR-4,Cu base,High TG FR-4,PTFE,Rogers, etc.
Board thickness 0.20mm-8.00mm
Maximum Size 600mmX1200mm
Board Outline Tolerance +0.10mm
Thickness Tolerance(t≥0.8mm) ±8%
Thickness Tolerance(t<0.8mm) ±10%
Insulation Layer Thickness 0.075mm--5.00mm
Minimum Line 0.075mm
Minimum Space 0.075mm
Out Layer Copper Thickness 18um--350um
Inner Layer Copper Thickness 17um--175um
Drilling Hole(Mechanical) 0.15mm--6.35mm
Finish Hole(Mechanical) 0.10mm-6.30mm
Diameter Tolerance(Mechanical) 0.05mm
Registration(Mechanical) 0.075mm
Aspect Ratio 16:1
Solder Mask Type LPI
SMT Mini.Solder Mask Width 0.075mm
Mini. Solder Mask Clearance 0.05mm
Plug Hole Diameter 0.25mm--0.60mm
Impedance control Tolerance ±10%
Surface finish/treatment HASL,ENIG,Chem,Tin,Flash Gold, OSP, Gold Finger
 
Company Profile

High-Density Interconnect FPC PCB Board with UL Certification and 100% E-Test
Process

High-Density Interconnect FPC PCB Board with UL Certification and 100% E-Test
Certifications

High-Density Interconnect FPC PCB Board with UL Certification and 100% E-Test
ISO9001:2015, IATF16949:2016, ISO14001:2015, UL

Our manufacturing portfolio meets the stringent requirements across nearly all industries and PCB applications. You'll find our products in sectors such as digital products, voice control devices, motherboards, control products, security systems, medical devices, and new energy car accessories.
In addition, we are proficient in producingflex and rigid-flex circuits, multilayer circuit boards, impedance boards, high-frequency boards, aluminum substrate circuit boards, rigid PCBs tailored to customer needs. We also have an automated patch production line forPCB assembly, and we can also providePCB copy services based on customer samples. Our products are aimed at the mid-to-high-end market and are ideal for use in medical equipment, GPS devices, aircraft, satellite controllers, smart cars, transmitters, and more. Double-sided boards
Packaging & Shipping

High-Density Interconnect FPC PCB Board with UL Certification and 100% E-Test
High-Density Interconnect FPC PCB Board with UL Certification and 100% E-Test
High-Density Interconnect FPC PCB Board with UL Certification and 100% E-Test
High-Density Interconnect FPC PCB Board with UL Certification and 100% E-Test
 
FAQ

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Diamond Member Since 2024

Suppliers with verified business licenses

Manufacturer/Factory & Trading Company
Number of Employees
52
Plant Area
3000 square meters